常見問題
Frequently Asked Question
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Q:Could you let me know how to glue ceramic and ceramic?A:We glue the ceramic tiles to each other by hot pressing. The bonding material is the high Tg Epoxy. The glued temperature is about 200oC.
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Q:Could you let me know that are you able to fill Via by only Au (not use Cu or Ag) And can you make conductor by only Au?A:Now, we have no experience to fill the Via by only Au due to we have no the hole filled Au paste and also Au is too expensive to be the conducting function material.About the metallization of the ceramic substrate, adhesion strength between Au and Al2O3 is weak.So, we cannot make the conductor by only Au, but we can make the Al2O3/Au inner material as thin as possible.
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Q:What I want to know is for multi layer, you do glue ceramic and ceramic by epoxy, right? So, this point that inosculated by epoxy, is there any problem with dicing?? For example, when we dicing the multi layer, the point that inosculated by epoxy is separated or something like this~A:Our product is different from multilayer ceramic. Our material is fully sintered Al2O3 whose material strength is much better than multilayer ceramic. We do not have any material separate issue in our experience. The flexural strength of our ceramic material is 320 Mpa.
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Q:When we dicing the multi layer, the point that inosculated by epoxy is separated?? What I want to know is for multi layer, you do glue ceramic and ceramic by epoxy, right? So, this point that inosculated by epoxy, is there any problem with dicing?? For example, when we dicing the multi layer, the point that inosculated by epoxy is separated or something like this~A:We are normally make laser V-cut to break it. They may happen some separated issue with wrong breaking method that we will provide the holder to avoid from that.
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Q:Purity of Au which TH use at Au platingA:To make Pure Au TH, the thickness of Au layer have to higher than 70um, it will be take USD 2,000/pnl to do that.
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Q:The method of Roughness(surface) for Ceramic and Plating??How to control or Method of Surface Roughness control?A:By roughness test at OQC and FQC.
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Q:Plan for improving adhesion between Ceramic or Ag & Au Plating and Silicone?Do you have any suggestion or method for improving adhesion?1. Ceramic and Plating, 2. plating and solder, 3. Ceramic, Ag , Au and siliconA:The adhesion between Ceramic and metal material is good.
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Q:Do you have any method as surface treatment for improving adhesion?A:The adhesion between Ceramic and metal material is good.
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Q:As I requested, for different thickness of Al2O3 substrate 10mil / 15mil / 20mil /25mil / 30mil / 35mil / 40milA:We don't have thickness 10mil substrate but must be much more expensive because not standard and higher producing fail rate.It will be same price in 15mil(0.38mm) / 20mil (0.5mm) / 25mil (0.635mm) / 0.8mm /40mil(1mm) The tolerance will be based on the thickness of the ceramic substrate.Normally, the standard tolerance will be 10% of the substrate thickness.However, tolerance limit (Have to carefully control) is 8%.
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Q:What's method for Adhesion test? - as I requested, it's between metal/silicon and ceramic/silicon interface.So, would you please provide me criteria for this adhesion test ?A:For the adhesion test, we did red-ink test to make sure the completely sealed. And also, we did the red-ink test after high temperature/humidity and thermal cycle test to make sure the well connect between the ceramics. The adhesion strength between ceramic/silicon and metal/silicon is normally depended on the silicon material. Shown as the following picture, it's the example that we diced for our customer. Although, we do not have adhesion test equipment for the adhesion strength but we can find well adhesion between ceramic/silicon and metal/silicon after panel diced (No material separated was observed). As we know from the LED package manufacturing, the adhesion behavior between ceramic/silicon and metal/silicon are detected by red-ink test after material being heated or life loaded.
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Q:When you do dicing(by dicing saw machine, blade)the multi layer, is the point that inosculated by epoxy, separated?A:Our product have no this issue before, we will check again if there any simlar condition.We did some dicing tests for the COB product whose size is 10 by 10 mm.Shown as following pictures, there was no seperate behavior between ceramics.
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Q:3 How many level could TSK produce for DPC Multi Layer?A:We can make 2 layers (top and bottom side, and with/without via holes).
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13.Q:4. Could you set a angle to Ceramic Reflector?If so, how degree can you produce?? Minimum and maximum degree?A:The angle of the ceramic cavity is alomost fixed at about 85 degree.
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14.Q:5. Does TSK have Mass Production experience for Multi Layer?A:Our major COB products are 3*3 chip array (10 by 10 mm), 5*5 chip array (25 by 25 mm), 7*7 chip array (32 by 32 mm) and 10*10 chip array (50 by 50 mm).
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Q:The final Au-layer of metallization must be suitable for gold ball wire bonding. Which thickness of gold layer do you propose for it?A:Our surface finish is well for gold wire bonding, whose material is Ni 200", Pd 3"and Au 3".
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Q:Are the tooling fees and prices for marking necessary for lithography or silk screen printing?A:The tooling fee including the photolithographic mask, the screens for printing and samples.
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Q:As well as we will place the first order, we understand that you need to be sure, that your expenses will be covered. On the other hand it's desired for us to know which kind of guarantee you can give us, that the contract and delivery will be fulfilled properly.Please let me know what you propose to make this business successful and sure for the two parties.A:We can guarantee our supply are good if not in fist deliever, we can free to send you samples again till confirm. For future offer we also guarantee for monthly to an year. But please let me know what's your testing rules and environment, that we are able to do test before deliver to you.